Capabilities Narrative:
Manufacture, design & sale of manual & semiauto thermosonic wire, ribbon and ball bonders; TAB bonders; Semiautomatic Epoxy, Eutectic, Silverglass and laser diode die bonders; DFS
universal bonder test units and heated workstages.
Special Equipment/Materials:
Laser Diode bonders with pulsed-spot-heat workstage. Semiautomatic Silverglass die attach bonders. Long reach-deep access wedge and ball bonders. DFS universal bonder force test unit.
Business Type Percentages:
Manufacturing (95 %)
Research and Development (4 %)
Service (1 %)
Bonding Levels
Construction Bonding Level (per contract)
$0
Construction Bonding Level (aggregate)
$0
Service Bonding Level (per contract)
$0
Service Bonding Level (aggregate)
$0
NAICS Codes with Size Determinations by NAICS:
#
|
Primary?
|
Code
|
NAICS Code's Description
|
"Buy Green"? (1)
|
Small? (2)
|
1
|
Yes
|
333242
|
Semiconductor Machinery Manufacturing
|
|
Yes
|
2
|
|
811219
|
Other Electronic and Precision Equipment Repair and Maintenance
|
|
Yes
|
(1) By entering Yes for "Buy Green", the firm asserts that it obeys EPA guidelines for environmental friendliness for this NAICS code. Note, EPA guidelines do not exist for every NAICS
code.
(2) If Yes, the firm's revenues/number of employees do not exceed the NAICS code's small business size standard.
|
Keywords:
Bonders, Bonding, Die attach, Epoxy die attach, Eutectic die bonding, RIBBON bonding, SILVER GLASS, TAB, Thermoplastic, Thermosonic bonders, Ultrasonic bonders, Ultrasonic soldering, Wire
Bonding, Wire bonders
Miscellaneous:
Quality Assurance Standards:
(none given)
Electronic Data Interchange capable?:
[ ] Yes [ ] No